Wouldn’t It Be Great If…

All plastic encapsulated microcircuits could be molded in clear packaging?  A good friend of mine sent me a similar photo like this TSL series part a while back.  We were discussing how the need for X-ray and decapsulation would no longer be necessary for counterfeit avoidance, allowing inspection of the die frame, wire bond integrity and die markings directly through the plastic mold.

I have heard the main reason the majority of PEM’s are black in color is because most chips are sensitive to light and heat.  The color black is better suited for absorbing both.  

So I figured I’d turn this question over to the community, are there other reasons clear plastics aren’t a viable option for some components?